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DI water purification is used when high-purity water is required, for example, in bath makeups, rinses before plating steps, and final rinses necessary to maintain low ionic residues on board surfaces. Mil-spec PC boards must pass the MIL-P-28809 test for ionic cleanliness. This is done by final rinsing in DI water. Deionized water is made by the ion exchange technique. This involves passing water containing dissolved ionics through a bed of solid organic resins. These convert the ionic water contents to H+ and OH . Deionized water systems are more practical when using feedwater low in ionic and organic content. Other requirements are as follows: pH: 6.5 8.0 Total organic carbon: 2.0 ppm Turbidity: 1.0 NTU Chloride: 2.0 ppm

Two-sided printed circuit boards are usually processed by first drilling and deburring, then metallizing the through hole. Multilayers require treatment prior to any metallization process. Resin smear must be removed from the innerlayers, and texturing of the epoxy surface enhances hole wall adhesion. The preprocessing can be categorized as either smear removal or etchback.

Fresh solution replenishment is crucial for effectively attacking smear and achieving uniformity through the holes. Circulation pumps and 90 C work piece movement are required to prevent temperature stratification of the heated baths as well as assist in forcing fresh chemistry through the holes. Higheraspect-ratio holes may require vibration to dislodge air bubbles from the holes and enhance uniformity of attack (see Chap. 29).

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Smear Removal High-speed drilling machines are used to drill holes into the PWB dielectric. During the drilling operation, sufficient heat is generated, causing the epoxy to melt. As the drill is withdrawn, the melted epoxy smears across and coats the innerlayer copper surfaces, causing a condition commonly known as drill smear (see Figs. 28.2 to 28.6).

Future trend of high-speed machining centres [19]

Etchback Etchback refers to the aggressive removal of the epoxy and glass that results in the protrusion of the innerlayer copper. When two surfaces of the innerlayer are exposed, it is referred to as two-point connection, and when three surfaces of the innerlayer are exposed, it is referred to as three-point connection. Physically, the innerlayer copper will protrude from the drilled-hole three-point connection for copper bonding, which is required on some mil-spec boards (see Fig. 28.7).

(b) FIGURE 28.2 PTH vertical and horizontal cross sections illustrating optimum innerlayer connection and smear removal.

4. 5.

Smear Removal/Etchback Methods The four methods commonly used utilize hole wall epoxy or dielectric oxidation, neutralization-reduction, and glass etching. Three of the four common methods employ technology that

Drill smear example (note smear on the innerlayer).

With high lead ball screw Cheap $350000 SPM, positioning 60 80 07 12 G Very low at a feed rate higher than 3 m/min 20 Need With linear motors Expensive $700000 GPM, contouring 80 120 1 2 G High even at higher feed rates 150 Need

FIGURE 28.6 PTH vertical and horizontal cross sections illustrating innerlayer smear and misregistration.

FIGURE 28.7 PTH vertical cross section illustrating optimum connection and etchback. (a) shows a drawing of expected cross section (b) shows an actual cross section with expected results.

oxidizes resin or dielectric, followed by a neutralization-reduction step The fourth method sulfuric acid solvates or dissolves resin or dielectric All methods remove smear, but the resultant surface of the epoxy affects hole wall pull-away and adhesion 28431 Sulfuric Acid This process has been used extensively for many years because of its ease of operation and reliability of results Disadvantages are lack of control, inability to attack certain resin systems, and the inability to create significant topography resulting in poor hole wall adhesion Operator safety is crucial since concentrated sulfuric must be used 28432 Chromic Acid Chromic acid is a more controllable method that imparts some topography for enhanced hole wall adhesion and has a longer bath life However, insufficient neutralization of the Cr+6 leads to copper voids The line cost of using chromic acid is appealing.

However, the Restriction of Hazardous Substances (RoHS) and waste treatment regulations of chromic acid add substantial costs that make this method a nonviable option Etchback is possible by double processing 28433 Permanganate Permanganate is the most widely used and preferred method in the industry This easy-to-control process incorporates electrolytic regeneration, which adds to consistency and increases bath lives Permanganate effectively removes drill smear from most materials and imparts some texturing to the resin that increases hole wall adhesion3 (See Fig 282) for an example of hole wall topography after etchback Problems result from lack of chemical control or inconsistent cure of the multilayer package Permanganate is also used as a second step in conjunction with the other methods to enhance hole quality4 28434 Plasma Plasma utilizes electrical current to generate a plasma from fluorocarbon gases.

Comparison of the characteristics among different feed drives [19]

7. 8.

This plasma oxidizes the epoxy resin and removes drill smear Longer cycles or double cycling will generate etchback Plasma works on any material and is especially effective when processing polytetrafluoroethylene (PTFE)-based dielectrics This process has few.

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